DMC TSC-30/IC Dokumentacja Pobierz pdf (Strona 21)

TSC-30/IC Product Specification

11020s

17510 C

1 to 4 C/s

220 C or higher, 50s max.

255 C or higher, 10s max.

260 C max.

Time

Package’s surface temperature

200 C or higher, 70s max.

8. Implementation Temperature Specification

We do not recommend the wave soldering method.

1. Reflow method (Infrared reflow, air reflow)

Frequency: Three times or less

Temperature: The following device surface temperature profile is recommended.

Figure 1: Infrared reflow, air reflow temperature profile

2. Soldering iron (Manual soldering)

Soldering bit’s temperature: 370 C or lower

Soldering time: Five seconds or less/terminal

1 2 ... 16 17 18 19 20 21 22 23 24 25 26 ... 38 39

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DMC TSC-30/IC Dokumentacja Strona 21